|The fully integrated Wafer Process|
In the Schmid production process the wafers are singularised, horizontally cleaned and measured inline as to mechanical and electrical properties.
|The wafers are singularised in a water bath: by this method mechanical stress is reduced to a minimum. Afterwards the singulation lines feed the wafers into the cleaning line, at its output the wafers are brought together again on one single track by means of a Bernoulli-gripper. The wafers are subsequently tested and classified contact-free. After the wafers have passed the testing units they are laid down respectively slide softly into the Schmid boxes.|
|The Schmid Wafer-Inline-System is fully automated; no manual handling is required.|
|Please click to see the wafer processing described in detail:|