Meyer Burger Technology Ltd today announced that it has concluded two further significant contracts for its DW288 Series 3 diamond wire cutting platform. Two existing PV customers in Asia and Europe have chosen Meyer Burger's diamond wire cutting technology in order to increase their production volume of solar wafers.
The total value of the two contracts is around CHF 15 million. Delivery and installation of the diamond wire saw platforms are planned by the end of 2016.
With the market success of its pioneering diamond wire cutting technology, Meyer Burger continues to increase its share of the growing mono-crystalline slicon wafer market.